Tomshardware
February 29, 2024
The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
固定链接 ' $300 million of CHIPS Act R&D funds is officially up for grabs as U.S Department of Commerce opens applications for packaging technology ' 提交: February 28, 2024, 3:33am CST
The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
固定链接 ' $300 million of CHIPS Act R&D funds is officially up for grabs as U.S Department of Commerce opens applications for packaging technology ' 提交: February 28, 2024, 3:33am CST