Tomshardware
May 01, 2024
TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs.
固定链接 ' TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI ' 提交: May 1, 2024, 9:44am CST
TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs.
固定链接 ' TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI ' 提交: May 1, 2024, 9:44am CST