A collaborative research team has demonstrated what it says is the first monolithic 3D integrated circuit manufactured at a commercial U.S. foundry.

Nvidia is evaluating whether to increase production of its H200 data center GPUs after demand from Chinese customers is expected to exceed current supply.

TechInsights says Huawei's Kirin 9030 is built on SMIC’s N+3 process: an incremental, DUV-based extension of its 7nm-class technology that pushes density without EUV but falls well short of true 5nm nodes amid rising yield challenges.

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison have demonstrated what they describe as the first regenerative photonic memory latch.

Intel has evaluated wet etch tools from ACM Research for its 14A fabrication process, raising political and national security concerns.

Cambricon Technologies is preparing one of the most aggressive production ramp-ups attempted by a Chinese AI chipmaker.

TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause.

China convened emergency meetings with its largest technology companies on Wednesday to assess how many of Nvidia’s H200 accelerators they intend to buy.

A growing body of forecasts from AMD, Nvidia, Broadcom, and major research firms now points toward a semiconductor market that passes the trillion-dollar threshold before the decade closes.

Intel’s new partnership with Tata signals a transformative step for India’s chip ecosystem, enabling domestic manufacturing, advanced packaging, and enterprise compute solutions.

The U.S. will allow Nvidia to export its H200 data center accelerators to “approved customers” in China, President Donald Trump announced on Monday.

Several suspects have been apprehended for allegedly violating export control laws regarding the supply of Nvidia H100 and H200 AI chips to China.

Nvidia has taken a $2 billion equity stake in Synopsys, as the two companies announced a long-term collaboration to accelerate electronic design automation workloads on GPUs.

AMD and HPE are expanding their long-running partnership with a new agreement that will bring the AMD Helios rack-scale AI architecture into HPE’s product portfolio from 2026.

U.S. government to inject up to $150 million in xLight, a startup developing EUV light source based on a particle accelerator, with the first CHIPS and Science Act grant by the Trump Administration.

Samsung researchers have published a detailed account of an experimental NAND architecture that aims to cut one of the technology’s largest power drains by as much as 96%.

Alchip and Ayar Labs team up to build optical connectivity solution based on TSMC's COUPE framework that lets fabless chip designers to easily add optical connectivity to their designs.

TrendForce reported on December 1 that NAND Flash wafer supply tightened sharply in November as AI workloads and enterprise SSD orders continued to drive sustained demand.

Apple is preparing to qualify Intel’s 18A process for its lowest-end M-series processor, according to a post on X from analyst Ming-Chi Kuo.

Micron is preparing a major expansion of its Hiroshima operations to build a dedicated high-bandwidth memory facility, according to a report by Nikkei Asia.