As Meta introduces its lineup of new AI chips, the company joins other tech giants in diversifying the AI accelerators used for specific workloads, and says that mainstream GPUs built for large-scale pre-training are less cost-effective for inference workloads.
Intel's CPU roadmap is unlike any the company has published in recent years, because its manufacturing ambitions and its product launches have to succeed simultaneously.
As cheap Chinese chips threaten to invade various sectors of the economy in Europe, STMicroelectronics is on track to improve the efficiency of its own fabs
Under the new agreement, the focus will shift to validating full process flows for nanosheet and nanostack device architectures and backside power delivery.
The two companies have worked together for more than a decade, with IBM unveiling what it described as the world's first 2nm node chip in 2021 as part of the partnership.
China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.
Taking to the stage at ISSCC, AMD’s Ramasamy Adaikkalavan talked through how AMD managed to fit nearly double the compute throughput into the same die area as its predecessor,
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.
Naga Chandrasekaran promoted to Chief Technology and Operations Officer as well as the general manager of Intel Foundry responsible for development of advanced process technologies and day-to-day operations.
Sources told Reuters that some U.S. chipmaking firms are running low on scandium — a crucial rare earth material for making 5G chips — as they suffer delays from acquiring export licenses from Beijing.
A new investigative report from The New York Times reveals that, in July 2023, senior US intelligence officials privately briefed some of the tech industry's most powerful executives on classified assessments regarding China and Taiwan.
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules.
Japan’s state-backed foundry Rapidus plans to begin production of 2nm-class semiconductors in the second half of its fiscal year 2027, with full-scale production expected in 2028.