JEDEC is nearing completion of SPHBM4, a standard that enables full HBM4 bandwidth over a 512-bit interface using a 4:1 serialization, reusing standard HBM DRAM dies and a base die. The tech promises to enable a 2.5D integration on organic substrates to support up to 64 GB per stack and more stacks than HBM4 and HBM4E.
Biwin launches a very special DDR5-6000 192GB memory kit from its OC labs. Can the spacious memory kit outperform the current competition on the market?
HBM is undergoing its first major architectural overhaul in a decade, as HBM4, HBM4E, and C-HBM4E will introduce a 2048-bit interface, logic-node base dies, and optional custom memory logic inside base dies, enabling up to a 2.5X performance leap between 2025 and 2027.
The diversion of DRAM capacity into HBM for AI has already doubled memory prices, pushed DDR5 above $27 per 16 Gb, and, according to Gerry Chen of TeamGroup, will leave the market short through at least 2027–2028 as new fabs come too late to relieve supply.
The memory crisis has hit Framework, the company behind highly customizable laptops that users can upgrade on their own. Framework sells SO-DIMM modules on its website that are now all out of stock, with only two DDR4 models still remaining. These can be purchased separately, while the company still has some DDR5 inventory left that it'll be bundling with its DIY Edition laptops.
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