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✇Tomshardware

Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals

Rapidus plans to outline its early-stage work on panel-level packaging using 600 × 600 mm glass substrates at SEMICON Japan, highlighting an aggressive plan to leapfrog rivals by combining glass-core substrates and PLP for future AI and HPC chiplet packages.

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Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks

Intel and imec demonstrate the first 300-mm, fab-compatible integration of contacts and gate stacks for 2D transistors, marking a critical step in turning long-studied 2D materials from lab experiments into a realistic future option for high-volume logic manufacturing.

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Enthusiast modder stuffs an entire gaming PC inside a gutted Commodore PET 2001 — replaced the screen with an iPad Retina LCD, but the original keyboard still works

A Redditor found a "pre-gutted" Commodore PET 2001 that they repurposed as a fully-fledged gaming PC, while keeping the Commodore's keyboard intact and functional. The internals are relatively modest, but they can still play most modern games on the retrofitted screen, which is a Retina LCD from an iPad.

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